Job/Position Summary
The Senior Process Engineer – Cleaning Processes is responsible for the development, optimization, qualification, and control of advanced cleaning processes used in glass panel semiconductor manufacturing. The role focuses on achieving superior surface cleanliness, defect reduction, adhesion performance, and process stability for downstream metallization, lithography, and plating operations.
This position plays a critical role in establishing robust cleaning technologies for advanced packaging and glass substrate integration.
Primary Responsibilities
- Develop and optimize cleaning processes for glass substrate preparation, pre-clean before Laser treatment, and Litho pre-cleaning.
- Define and control critical process parameters, including chemistry concentration, temperature, immersion time, and drying conditions.
- Own and improve cleaning process performance with focus on defect reduction, surface cleanliness, and adhesion enhancement.
- Lead root cause analysis and corrective actions for particle contamination, residues, staining, corrosion, and delamination issues.
- Drive process qualification, DOE execution, and recipe optimization for new tools, materials, and chemistries.
- Work closely with wet chemistry and analytical teams to ensure bath stability, contamination control, and process consistency.
- Develop and maintain SOPs, process specifications, OCAPs, and process control documentation for manufacturing operations.
- Support pilot line and high-volume manufacturing ramp activities with emphasis on yield improvement and process robustness.
- Ensure compliance with EHS and chemical safety requirements while driving continuous improvement in chemical usage, cycle time, and manufacturing efficiency.
- Own equipment process qualification activities, including SAT, installation, operational, and performance qualifications, process acceptance, and production release for DFR developer and stripper tools.
- Collaborate with equipment engineering teams to improve wet bench capability, process stability, and equipment reliability.
- Drive preventive maintenance optimization and equipment health monitoring in collaboration with maintenance and equipment engineering teams to improve MTBF and reduce MTTR.
- Lead troubleshooting and recovery of wet process equipment issues related to pumps, heaters, filtration systems, chemical delivery, sensors, and automation interfaces to minimize production downtime.
Requirements
- Engineering degree in Chemical Engineering, Materials Science, Chemistry, Metallurgy, or related field required.
- 8 – 12 years of experience in electroless copper plating, metallization processes, semiconductor wet processing, or advanced packaging technologies.
- Willing to relocate to Albuquerque, New Mexico, for 1-2 years and willing to relocate to India for 2 years or permanently. Or if currently in India, will require relocation to Bhubaneswar, Odisha.
Knowledge, Skills, and Abilities
- Strong understanding of glass surface chemistry, particle contamination control, wet cleaning methods, and compatibility.
- Experience with SPC, DOE, FMEA, and analytical characterization techniques
- Panel-level packaging experience is preferred.
- Experience in wet processes and familiarity with characterization tools preferred.
Physical/Working Requirements
- Must be able to wear personal protective gear most of the day (where applicable).
- Prolonged periods of sitting or standing.
Behavioral Traits
- Strong verbal and written communication skills to convey quality standards, expectations, and feedback clearly to team members and stakeholders.
- A willingness to adjust to changing circumstances, processes, or technologies for continuous improvement in dynamic environments.
- The ability to work well with others, fostering a cooperative atmosphere, driving data management initiatives, and engaging all levels of the organization.
