Role Overview 

Astera Labs is redefining the connectivity fabric that powers rack-scale AI infrastructure. As a Principal Engineer on the Physical Design team, you will own the backend implementation of complex, high-performance SoCs that sit at the heart of the world's largest AI clusters — driving floorplan, timing, power, and signoff decisions that directly determine product PPA and time-to-market. 

This is a hands-on technical leadership role. You will architect physical design methodology, mentor senior engineers, and partner closely with RTL, DFT, analog, and package teams to take our next generation of connectivity silicon from RTL to tapeout on leading-edge nodes. 

Key Responsibilities 

• End-to-End RTL2GDS Ownership 
• Own the full RTL2GDS flow on advanced process nodes — synthesis, floorplan, placement, CTS, routing, and signoff — across Astera's connectivity product portfolio 
• Drive block- and chip-level place & route strategy, congestion resolution, and routing convergence on high-frequency, high-density designs 
• Architect clock tree synthesis and clocking topology to meet skew, latency, and power targets 
• Lead tapeout execution: final ECO closure, GDS handoff, and post-tapeout support through fab 
• Timing, Power & Signoff 
• Drive multi-mode multi-corner STA closure, low-power implementation (UPF/CPF), and IR/EM analysis to signoff 
• Own physical verification (LVS, DRC, antenna, ERC) and reliability signoff through clean closure 
• Define methodology for ECO flows, hierarchical timing, and full-chip signoff sign-around 
• Technical Leadership & Cross-Functional Partnership 
• Partner with RTL, DFT, analog/mixed-signal, package, and CAD teams to converge on floorplan, clocking, and power delivery strategies 
• Establish and evolve physical design methodology, scripts, and flows across the team 
• Mentor engineers, drive design reviews, and represent Physical Design in program-level technical decisions 

Basic Qualifications 

• Bachelor's degree in Electrical Engineering, Computer Engineering, or related field 
• 8+ years of physical design experience with multiple tapeouts on advanced process nodes (7nm or below) 
• Deep expertise in synthesis, place & route, CTS, and timing closure using industry-standard tools (Synopsys Fusion Compiler / ICC2, Cadence Innovus, PrimeTime) 
• Strong command of low-power design techniques (multi-Vt, power gating, DVFS, UPF) 
• Proficiency in Tcl/Python scripting for flow automation 
• Proven track record delivering high-frequency, high-complexity SoC blocks or full-chip implementations to production 

Preferred Qualifications 

• MS in Electrical Engineering or Computer Engineering 
• Experience with high-speed SerDes-heavy designs, PCIe Gen 6/7, or UALink/UCIe-based connectivity SoCs 
• Hands-on experience with hierarchical implementation and full-chip integration of large designs (>500M gates) 
• Familiarity with EMIR, thermal, and package co-design considerations 
• Experience mentoring senior engineers and driving methodology adoption across teams 

Salary range is $185,000 to $240,000 depending on experience, level, and business need. This role may be eligible for discretionary bonus, incentives and benefits.