Kapta Space, a VC-funded early-stage startup in Seattle, WA, is breaking new ground in Geospatial Intelligence. Our technology centers around a proven, scalable electronically-steered radar for sophisticated spaceborne applications such as earth observation using synthetic aperture radar (SAR) techniques, as well as enabling advanced defense missions such as target tracking on the ground and in the air.
Kapta Space is seeking an accomplished Senior PCB Designer to own the architecture, execution, and quality assurance of printed circuit board layouts supporting our scalable Metasurface electronically-steered array (MESA) hardware for sophisticated spaceborne synthetic aperture radar (SAR) and advanced defense target-tracking missions. This role blends hands-on technical layout work while following standards, design processes, as part of our small team of PCB designers. The ideal candidate will have extensive experience developing high-speed, mixed-signal, RF, and power boards for space or aerospace environments and thrive in a fast-paced, multidisciplinary setting.
Key Responsibilities
PCB layout design for high-speed digital, mixed-signal, RF front-end, and power management boards supporting spaceborne radar payloads and phased-array antenna modules.
In collaboration with the Responsible Engineer (RE), provide inputs to define and maintain board-level architecture, layer stack-ups, and routing strategies ensuring signal integrity, impedance control, and EMI/EMC compliance.
Execute detailed component placement and routing for complex multi-layer designs including high-density BGAs, SERDES, DDR, FPGA, and high-frequency RF interconnects.
Perform full lifecycle design ownership — from schematic collaboration and layout execution, DFM efforts through fabrication, assembly, and bring-up support.
Partner with RE to integrate board design within mechanical, RF, thermal, and system-level constraints, ensuring mechanical compatibility, manufacturability, and serviceability.
Serve as point of contact for standardized PCB layout , DFM/DFA/DFT rules, ECAD constraint management, and centralized component-library oversight .
Partake in formal design reviews, enforce design rules, and ensure documentation packages meet aerospace and defense standards.
Coordinate with Contract Design Services partners to ensure alignment with internal engineering standards and deliverables. Collaborate with RE and Program Office to support PCB fabrication and assembly vendors DFM and inquiries, ensuring compliance with stack-up, impedance, and material specifications for space/defense environments.
Contribute to supply-chain readiness and material qualification efforts for high-reliability boards (e.g., polyimide, low-outgassing, or radiation-tolerant materials).
Required Qualifications
Associates or Bachelor’s degree in Electrical Engineering, Computer Engineering, or related discipline (or demonstrated equivalent skills and experience).
Significant experience of professional PCB layout experience
Significant experience as a principal-level individual contributor working with multi-disciplinary engineering teams delivering complex spaceborne hardware.
Expert proficiency in Altium Designer and strong command of constraint-driven design.
Understanding of impedance control, differential pair routing, grounding strategies, thermal management, and EMI/EMC mitigation.
Significant experience with DFM/DFA/DFT principles and close collaboration with PCB fabrication and assembly vendors.
Familiarity with aerospace or defense hardware design requirements (shock, vibration, thermal, radiation, reliability).
Experience leading Altium toolchain integration, library management, and automation/scripting.
Excellent communication skills, with ability to present to senior leadership and collaborate with customers and suppliers.
Must be eligible to work on U.S. export-controlled projects (ITAR).
Bonus if candidates have experience and skills in the following areas:
Experience designing PCBs for spacecraft payloads, synthetic aperture radar systems, or electronically-steered RF arrays.
Proficiency with 3D ECAD/MCAD co-design workflows and mechanical constraint management.
Knowledge of IPC Class 3 and NASA or MIL specifications for PCB fabrication and assembly.
Exposure to high-power or high-voltage design practices and power-integrity simulation tools.
Layout skills for Power and Signal Integrity
Knowledge of thermal transfer through PCB materials is a plus
Experience with high frequency RF routing principles and circuits.
Experience developing mission-critical hardware for space and/or defense environments.
Significant experience designing complex multi-layer PCBs with high-speed interfaces (PCIe, DDR, SERDES, JESD, Ethernet).
May require occasional travel to fabrication partners or testing facilities.
Flexibility to support critical program milestones during extended hours when necessary.
Concerned you do not meet all the requirements? Not a problem - please apply even if you do not meet all these criteria.
