What We’re Looking For:

We’re looking for PIC (photonic integrated circuit) design engineers to contribute to and own aspects of the wafer-scale photonic interposer PIC. This will involve solving unique problems in creative ways, such as the tension between density and manufacturability yields, dealing with process variation on large scale wafers, etc. 

Ideal Candidates:

Ideal candidates will have:

• Experience with both passive and active PIC design components 
• An understanding of the fundamental physics at play, not just a “simulate and turn the crank” attitude 
• Experience with large device count PIC tapeouts 
• Deep understanding of optical coupling in and out of the PIC, especially how to achieve very low losses under realistic manufacturing conditions (alignment, etc) 
• Understanding of the physical manufacturing process behind PICs

Nice to Have:

• Experience with high speed optical communications PICs
• Experience in designing with PIC material platforms other than silicon photonics (eg InP, TFLN, SiN, polymers, glass, etc)
• Experience and knowledge of active gain chip integration (eg integrated lasers, SOAs, etc)
• Experience with large area PICs
• Understanding of sources of process variation, statistical process control, etc