Why join Upscale, Inc.
Upscale, Inc., is building the high-performance infrastructure powering the next generation of artificial intelligence. Backed by over $300M in funding and rapid global adoption, we are scaling systems designed for the world’s most demanding AI workloads.
We focus on first-principles engineering across silicon, systems, and networking—where performance, scale, and execution are critical. Our team is talent-dense and high-performing. We value ownership, technical rigor, and speed, and we offer the opportunity to work on foundational problems with immediate, real-world impact.
If you’re looking to do high-impact work, move fast, and help define the infrastructure behind the future of AI—Upscale is where you can produce meaningful work at the frontier—and operate at a high standard.
As a Principal Mechanical Design Engineer – You will be responsible for being the lead mechanical lead design engineer in working cross functionally with other HW engineers and operations in developing high-quality low-cost system design solutions. You will work in close collaboration with HW EE, SI, Mechanical/Thermal Engineers peers, operations teams, contract manufacture and mechanical enclosure suppliers.
Responsibilities
Strong understanding of liquid ORV3 cooled system design.
Strong understanding of comprehensive thermal requirements with high complexity heatsinks, custom cold plates, manifolds and advanced thermal solutions.
Lead, mentor, and less experienced mechanical design engineers. Provide technical guidance and problem-solving expertise.
Excellent understanding of the mechanical development phases, from feasibility, hand calculations & trade studies to conceptual CAD generated to detailed design files, prototyping, testing, through final production release.
Collaborate with cross-functional teams including electrical engineering, software, manufacturing, and product management to ensure seamless integration and product success.
Strong understanding of part drawing standards and tolerancing practices.
Strong understanding of the overall product development process.
Identify and implement new technologies and tools to enhance design capabilities and efficiency.
Strong understanding of the product compliance system requirements with relevant industry test standards.
Strong understanding of product testing. Capable of determining test setup and both non-operational vibration and shock test limits to ensure product quality.
Present detailed system design/thermal reviews across the entire NPI team.
Strong team collaboration. Conduct and participate in whiteboard brain discussions with the entire team.
Work closely with mechanical suppliers to better understand manufacturing capabilities, delivering high-quality, low-cost part design solutions.
Willing to share the sustaining effort and/or support.
Willing to travel to support both domestic and/or foreign supplier parts and assembly FAI approvals. Support operations contract manufacturing partner by being on site for early development, QA and FCS builds.
Qualifications
Bachelor's degree in mechanical engineering.
Minimum of 15 plus years of experience in network enclosure system design.
Proven track record of successfully leading and delivering high-quality low-cost complex design solutions.
Strong proficiency in CAD software (SolidWorks and PDM).
Expertise in DFM (Design for Manufacturing) and DFA (Design for Assembly) principles.
Strong understanding of part manufacturing processes (e.g., injection molding, sheet metal fabrication, machining).
Strong understanding of estimated mechanical enclosure parts & hard tooling cost.
Excellent communication, and interpersonal skills.
Ability to manage multiple projects simultaneously and prioritize tasks and resources effectively.
Problem-solving mindset with strong attention to resolution.
Excellent understanding of the entire thermal development process (e.g., feasibility, simulations, system thermal profiling, and fan policy).
Desired Skills:
Strong design background in network equipment.
Hands-on lab experience in mechanical or thermal problem solving as well as periodically supporting small system builds during early development phases.
Strong relations with rapid prototyping techniques.
Excellent collaboration skills with others.
